Federal Register, Volume 86 Issue 80 (Wednesday, April 28, 2021) 
[Federal Register Volume 86, Number 80 (Wednesday, April 28, 2021)]
[Notices]
[Pages 22387-22389]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-08785]

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DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-31-2021]

Foreign-Trade Zone (FTZ) 45--Portland, Oregon; Notification of
Proposed Production Activity; Lam Research Corporation (Semiconductor
Production Equipment, Subassemblies and Related Parts), Tualatin and
Sherwood, Oregon

    The Port of Portland, grantee of FTZ 45, submitted a notification
of proposed production activity to the FTZ Board on behalf of Lam
Research Corporation (Lam), located in Tualatin and Sherwood, Oregon.
The notification conforming to the requirements of the regulations of
the FTZ Board (15 CFR 400.22) was received on April 14, 2021.
    Lam already has authority to produce semiconductor production
equipment, subassemblies and related parts within Subzone 45H. The
current request would add finished products and foreign status
materials/components to the scope of authority. Pursuant to 15 CFR
400.14(b), additional FTZ authority would be limited to the specific
foreign-status materials/components and specific finished products
described in the submitted notification (as described below) and
subsequently authorized by the FTZ Board.
    Production under FTZ procedures could exempt Lam from customs duty
payments on the foreign-status materials/components used in export
production. On its domestic sales, for the foreign-status materials/

components noted below and in the existing scope of authority, Lam
would be able to choose the duty rates during customs entry procedures
that apply to the finished products in its existing scope of authority
and to the finished products listed below (duty free).
    Lam's proposed finished products include tools and process modules
for--and installation, maintenance, repair, retrofit, and upgrade kits
for tools and process modules for--the following: Chemical vapor
deposition, physical vapor deposition, and plasma dry etch of materials
on a wafer for semi-conductor production; plasma etch of the bevel edge
of a wafer to remove yield-limiting residues and defects of a wafer
surface for semi-conductor production; stripping of photoresist
material on a wafer for semi-conductor production; ultraviolet thermal
processing of a wafer surface for semi-conductor production; and, wafer
cleaning between chip-processing steps to remove yield-limiting
residues and defects of a wafer surface for semi-conductor production.

    Lam's proposed finished products also include installation,
maintenance, repair, retrofit, and upgrade kits for the following:
Machines for the production of semiconductors, namely etch systems;
machines for manufacturing masks and assembling electronic circuits;
semiconductor equipment and parts and assemblies; chemical/mechanical
planarization and other wafer surface modification equipment; conductor
material deposition process modules and machines for wafer packaging;
transport modules; and, wafer transport robots.
    Finally, Lam's proposed finished products include: Chemical/
mechanical planarization and other wafer surface modification
equipment; conductor material deposition process modules and machines
for wafer packaging; transport modules; and, wafer transport robots.
Lam would be able to avoid duty on foreign-status components which
become scrap/waste. Customs duties also could possibly be deferred or
reduced on foreign-status production equipment.

[[Page 22388]]

    The materials/components sourced from abroad include: Diluted
hydrogen gas used for calibration; freon gas; ammonia hydroxide
solutions; potassium phosphate buffer solutions; sodium bicarbonate
buffer solutions; hydrogen peroxide; polyvinyl chloride (PVC) cement;
mineral oils used as machine lubricants; synthetic petroleum-based
hydrocarbon greases and similar synthetic oils and greases; thermal
joint compounds; scouring pastes and powders used for wafer polishing
activities; polymer-based sealants, glues, and pastes used in the
production and installation of semiconductor manufacturing equipment;
PVC-based sealants, glues, pastes, and cements used in the production
and installation of semiconductor manufacturing equipment; silicon-
based sealants, glues, pastes, and cements used in the production and
installation of semiconductor manufacturing equipment; polyglycol
dimethacrylate sealants, glues, pastes, and cements used in the
production and installation of semiconductor manufacturing equipment;

thermal transfer print ribbon films; organic solvents for cleaning;
sealants with activators; fluorine based coolants; epoxy resins;
silicone cements and fillers; panels, plates, and simple structural
components of plastics; cutting sheets of plastics; shims and simple
spacers of plastics; foam block silicon adhesive; panels, plates, and
simple structural components of rigid plastics; anti-static
polyethylene bags used as packaging material; clear nylon heat sealed
bags; plastic ductwork; heavy duty plastic gloves for acid protection;
handles and levers of plastic used in semiconductor manufacturing
equipment; hinges, mounts, latches, and brackets of plastic of a type
for furniture; retaining rings of rubber; soft rubber tubing used in
fluid/gas distribution; soft rubber tubing with fittings used in fluid/
gas distribution; vulcanized rubber belts used in wafer and equipment
movement; disposable gloves made of nitrile synthetic rubber used for
clean room environments; tri-polymer blend non-disposable gloves used

for clean room environments; plastic tool containers; plastic case
covers; silicone plastic tablet covers; non-textile, non-silicon
antistatic tissues and cleaning wipes with special surfactants for use
in clean room environments; paperboard and cardboard packaging
materials; paperboard labels; schematics, diagrams, and similar
technical drawings; right to use documentation; velcro tape, nylon line
and nylon support sling (parts of kits that are installed onto wafer
fabrication equipment systems); clear acetate face shields and
protective caps; high-density polyethylene hard hats and protective
caps; abrasive pads, disks and, strips for polishing semiconductor
wafers; slurry troughs and similar ceramic dispensary articles; fused
silica rods and pipes; safety glass windows; lamp bulbs; reflectors and
collimators; fused silica and fused quartz components, disks, windows,
liners, rings, tubes, holders, and funnels for laboratory semiconductor
manufacturing equipment; beakers and similar lab equipment for holding/

conveying chemicals; viewports for laboratory semiconductor
manufacturing equipment; fiberglass gaskets, spacers, and fasteners;
fiberglass rings and washers for use in semiconductor manufacturing
equipment process chambers; iron fittings for metal tubing used in
fluid/gas distribution equipment; stainless steel butt weld fittings;
stainless steel canisters and chemical tanks used for maintaining
chemicals for semiconductor manufacturing equipment of 304 or 316L;
stainless steel rope winches; steel support cables and wires--braided,
used as structural elements in semiconductor manufacturing equipment;
steel guard chains, driver chains, roller chains and links used in
mechanical equipment for wafer manufacturing equipment or installation
equipment; steel roller chains and other belt chains used in mechanical
equipment for wafer manufacturing equipment or installation equipment;
steel tie down straps; steel pins used as fasteners for semiconductor
manufacturing equipment; steel eyebolts; steel leaf springs; cast steel

brackets for support of semiconductor manufacturing equipment
components; copper conductor bars for transmission of radio frequency
(RF) energy; copper tubing used in fluid distribution in semiconductor
manufacturing equipment process; copper pipe fittings; aluminum top hat
rails and related clips; bus bars, ground bars, and rods of aluminum;
aluminum tape; aluminum labels; vacuum port screens of aluminum; tin
anodes for electrolytic processing of metals on wafers; tin anodes and
pellets for electrolytic processing of metals on wafers; jab saws;
hammers; insertion or extractions tool sets; helicoil or pipe tapping
tools; retractable knives used in installation/maintenance of
equipment; scissors used in installation/maintenance of equipment;
metal latches with locks; hardware type brackets and mounts of metal;
magnetically actuating cylinders; air cylinders for linear acting
engines and motors; pins, pin lifters and, shims for linear acting
engines and motors; hydraulic fluid power pumps; cryocompressors for

fluid temperature control; condensers and compressors used in
semiconductor manufacturing equipment; balancing scales; weight
measurement equipment; weights for measurement equipment; fire
suppression extinguishing systems; nozzles and orifices for fluid
distribution system; hoists for wafer transport robots; scissor jacks;
lift fixtures and lift fixtures parts for installation of semiconductor
manufacturing equipment; calibration disks for semiconductor
manufacturing equipment; barcode and thermal printers; slug buster
punches; equipment chucks and fixtures for test and installation and
related parts; electric drills, punches and, blades; helicoil repair
kits; electric pipe and cable cutters; tablet docking stations; plates,
pads, and lift fixtures, and related components of plastic, rubber,
metal, thermoplastic polyetherimide (PEI) resins and
polytetrafluoroethylene (PTFE) pins and materials; valve covers; valve
adapters; valve ball; valve panels; valve doors; valve plates; valve
pins; tapered roller bearings; needle roller bearings; cylindrical

roller bearings; roller bearings, ball screws and, radial ball
bearings; shafts, rollers, blocks and balls for bearings; chemical/
mechanical planarization and other wafer surface modification
equipment; gate, transport and loadlock valves that are specifically
designed for semiconductor applications; machines for manufacturing
masks and assembling electronic circuits; weldments tubing of
semiconductor manufacturing equipment tools; rings, arms, cups,
holders, plates, adapters, panels, pedestals and other inner components
designed specifically for semiconductor manufacturing equipment tools;
semiconductor manufacturing equipment sub-assemblies; structural
elements of other metals, plastic or aluminum enclosures or assemblies
with threaded inserts, screws, dowel pins, springs, and connectors for
housing, enclosures, covers, and skins for semiconductor manufacturing
equipment; bodies and parts of gate, transport and loadlock valves that
are specifically designed for semiconductor applications; air and

exhaust ducts, end effectors and media dispensers designed specifically
for semiconductor manufacturing equipment; DC motors with output >750 W
and <=75 kW; AC motors with output >74.6 W and <=746

[[Page 22389]]

W; pistons, guards and similar motor components; electro-magnetic load
coils and sensor magnets; alkaline batteries; lead storage batteries;
nickel metal hybrid batteries; induction heaters for semiconductor
manufacturing equipment; rod-type sheathed cartridge heaters used to
heat gases or liquids in distribution piping for semiconductor
manufacturing equipment; thermofoil used in heaters for semiconductor
manufacturing equipment; input/output cards and panels for network
equipment; load cell amplifiers, servo amplifiers and proximity
amplifiers; digital video recorders; videos on DVD; flash memory cards;
transponder readers; cathode-ray tube monitors for use with automatic
data processing (ADP) machines; LCD color flat screen monitors for use
with ADP machines; camera covers and holders of aluminum, stainless
steel, other metals, and plastic materials; smoke detectors and
sensors; sensors, lenses, frames and other parts of smoke detectors;
aluminum electrolytic fixed capacitors; dielectric fixed capacitors;

tube holders and mountings of polyvinylidene fluoride, polyvinylidene
difluoride (PVDF), other metals, or plastic materials; connectors for
optical cables; chassis, panels and boards for power distribution
modules and similar controllers; supports, ferrules, fuse holders and
similar parts of connectors; incandescent lamps and bulbs; discharge
lamps other than UV lamps; light-emitting diode (LED) lamps used for
illumination in semiconductor manufacturing equipment; electromagnetic
interference (EMI) shield rings; semiconductor transistors used in
electronic equipment; power block modules; semiconductor/crystal
oscillators used in electronic equipment; solid state devices
consisting of an LED and a photo diode; cables for voltage; graphite
electrodes; insulators and insulator elements of quartz; focal lenses
used for factory inspections; protective eyeglass frames; goggles and
similar protective spectacles; compound optical microscopes; lasers for
metrology and endpoint systems; optical light guide lenses; syringes;

temperature monitors and hydrometers; thermocouple sensors or adapters;
diaphragms, guards, adapters and gauges, vacuum filters and similar
parts for flow and pressure meters; monochromators; digital counters;
infrared sensors and radiation sensing equipment; multimeters; holding/
moving carts for power distribution equipment; fluorescent lamps
fixtures; and, pens and markers (duty rate ranges from duty-free to
20%). The request indicates that certain materials/components are
subject to duties under Section 232 of the Trade Expansion Act of 1962
(Section 232) or Section 301 of the Trade Act of 1974 (Section 301),
depending on the country of origin. The applicable Section 232 and
Section 301 decisions require subject merchandise to be admitted to
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
ftz@trade.gov. The closing period for their receipt is June 7, 2021.
    A copy of the notification will be available for public inspection

in the ``Reading Room'' section of the Board's website, which is
accessible via www.trade.gov/ftz.
    For further information, contact Christopher Wedderburn at
Chris.Wedderburn@trade.gov.

    Dated: April 22, 2021.
Andrew McGilvray,
Executive Secretary.
[FR Doc. 2021-08785 Filed 4-27-21; 8:45 am]
BILLING CODE 3510-DS-P